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SAN DIEGO--(BUSINESS WIRE)--June 5, 2001-- Applied Micro Circuits Corp. (AMCC) (Nasdaq:AMCC) and Zarlink Semiconductor(TM) (formerly Mitel Semiconductor) today announced they are developing multi-channel, interoperable 10 Gigabit per second (Gbps) per channel products that will offer customers complete short-reach optical connectivity solutions for high-capacity, next-generation networking systems.

Zarlink will introduce 12-channel, VCSEL-based parallel fiber modules operating at 10 Gbps per channel, for an aggregate bandwidth of 120 Gbps. AMCC will bring to market interoperable physical layer, switch fabric, network processing and framer products. The interoperability of AMCC's components and Zarlink's 10 Gbps per channel modules will enable optical systems vendors to quadruple equipment capacity, while reducing development cycles and time to market.

Zarlink expects the market for very short-reach parallel fiber solutions used in and between high-capacity network equipment to grow beyond US $1 billion within three years. The companies' new 10 Gbps parallel fiber products meet customer requirements for lower cost and higher speeds by offering four times the bandwidth density of today's 2.5 Gbps short-reach optical systems.

``This is the next step in our program to develop a family of very short-reach, high-capacity parallel fiber modules that deliver the industry's best price-performance ratio,'' said Claes Johansson, director of Zarlink's Optical Communications unit. ``Developing modules that transport data at 120 Gbps is made possible by continuing advances in our 10 Gbps VCSEL and patented packaging and manufacturing technologies.''

Collaborative work on the new 10 Gbps products follows a successful joint program to develop short-reach optical solutions operating at 2.5 Gbps per channel. Zarlink's current generation of 4-, 8- and 12-channel modules utilize AMCC's S7022 Quad VCSEL driver and S7025 Quad transimpedance amplifier (TIA), with integrated limiting amplifier and Loss of Signal (LOS) detection circuitry.

``We will continue to build on our successful relationship with Zarlink for complete terabit connectivity solutions that complement our PHY, framer/mapper, network processor, and switch fabric products for seamless distributed networking systems,'' said Paul Duran, AMCC's product marketing manager. ``This compelling technology is an essential ingredient in the development of terabit networking systems that require the lowest cost and power dissipation per gigabit as well the highest bandwidth density per square inch.''

Target applications for the new products include proprietary interconnects in high-capacity scalable multi-chassis routers, switches and optical cross-connects; and standardized interconnects between this type of equipment in central offices. For example, the combination of Zarlink's 10 Gbps per channel parallel fiber modules with AMCC's PHY/framer products will enable a complete and cost-effective 40 Gbps transponder solution for Very Short Reach (VSR) OC-768, compliant with proposed Optical Internetworking Forum (OIF) standards.

About Zarlink Semiconductor

Zarlink employs its formidable analog, digital and mixed-signal capabilities to offer the most compelling products for wired, wireless and optical connectivity markets and ultra low-power medical applications. Zarlink is trading as Mitel Corp. on the New York and Toronto stock exchanges under the ticker symbol ``MLT'' until the new legal name of the company -- Zarlink Semiconductor Inc. -- is approved by shareholders. For more information, visit www.zarlink.com.

About AMCC

AMCC designs, develops, manufactures and markets high-performance, high-bandwidth silicon solutions for the world's optical networks. AMCC utilizes a combination of high-frequency analog, mixed-signal and digital design expertise coupled with system-level knowledge and multiple silicon process technologies to offer integrated circuit products that enable the transport of voice and data over fiber optic networks. The company's system solution portfolio includes PMD, PHY, framer/mapper, network processor, traffic management and switch fabric devices that address the high-performance needs of the evolving intelligent optical network. AMCC's corporate headquarters and wafer fabrication facilities are located in San Diego. Sales and engineering offices are located throughout the world.

AMCC Forward-Looking Statements

The statements contained in this press release that are not purely historical are forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Such forward-looking statements including statements relating to new products derived from the relationship are subject to a number of risks and uncertainties, including the risk that such products would not be successfully or timely designed, developed or manufactured or achieve market acceptance, as well as the other risks and uncertainties set forth in the ``Factors That May Affect Future Results'' detailed in the Company's Annual Report on Form 10-K for the year ended March 31, 2001, and in other filings of the Company with the Securities and Exchange Commission. As a result of these risks and uncertainties, actual results may differ materially from these forward-looking statements. The forward-looking statements contained in this news release are made as of the date hereof and AMCC does not assume any obligation to update the reasons why actual results could differ materially from those projected in the forward-looking statements.

Zarlink Forward-Looking Statements

Certain statements in this press release constitute forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements involve known and unknown risks, uncertainties, and other factors which may cause the actual results, performance or achievements of the company, to be materially different from any future results, performance, or achievements expressed or implied by such forward-looking statements. Such risks, uncertainties and assumptions include, among others, the risks discussed in documents filed by the Company with the Securities and Exchange Commission. Investors are encouraged to consider the risks detailed in those filings.

Product photos, datasheets and application notes are available upon request. AMCC is a registered trademark of Applied Micro Circuits Corp. Zarlink Semiconductor and the Zarlink logo are trademarks of Mitel Corp.

     Applied Micro Circuits Corp.
     Bill Berridge, 858/535-4260
     billb@amcc.com
       or
     Karen Hartz, 858/535-3436
     khartz@amcc.com
       or
     Zarlink Semiconductor
     Claire Nagy, 613/270-7317
     claire_nagy@mitel.com
       or
     The Ardell Group (for AMCC)
     Angela Edgerton, 858/792-2941
     angela@ardellgroup.com
       or
     Katy Tanghe, 858/792-2910
     katy@ardellgroup.com
       or
     HIPR Inc. (for Zarlink)
     Tiana Wiersma, 503/222-1257
     tiana@hipr-inc.com